Third M.I.T. Conference on Computational Fluid and Solid Mechanics June 14–17, 2005  

Crack in a homogeneous piezoelectric material bonded to a functionally graded piezoelectric half plane

Yi-Liang Ou, Ching-Hwei Chue*
Department of Mechanical Engineering, National Cheng Kung University, Tainan City, Taiwan

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ABSTRACT
The problem for a crack located within a homogeneous piezoelectric material bonded to a functionally graded piezoelectric material is studied. It is subjected both to the mechanical and electrical loads. By using the Fourier transform and residue theorem, the problem can be reduced to a system of singular integral equations and then solved by the Gauss-Chebyshev integration formula. The dependency of stress and electric displacement intensity factors on the material nonhomogeneity parameter is discussed.

Keywords:  Functionally graded piezoelectric material; Crack; Stress and electric intensity factors; Gauss-Chebyshev integration formula

* Corresponding author: Tel.: +886 6 2757575; Fax: +886 6 2363950; E-mail: chchue@mail.ncku.edu.tw